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Rochester Electronics MC13226V

MICROPROCESSOR CIRCUIT PBGA99
part number has RoHS
Manufacturer # :MC13226V
Manufacturer :Rochester Electronics
Dasenic # :MC13226V-DS
Customer # :
Description : MICROPROCESSOR CIRCUIT PBGA99
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.9920$ 7.99
25+$ 7.8300$ 195.75
100+$ 7.5150$ 751.5
500+$ 7.1910$ 3595.5
1000+$ 6.7950$ 6795
In Stock: 1620
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.992
Total :$ 7.99
Delivery :
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MC13226V information

  • Rochester Electronics MC13226V technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Transceiver ICs
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:145-TFLGA
  • Frequency:2.4GHz
  • Type:TxRx + MCU
  • Sensitivity:-100dBm
  • Supplier Device Package:-
  • Data Rate ( Max):250kbps
  • Memory Size:128kB Flash, 80kB ROM, 96kB SRAM
  • Voltage - Supply:2V ~ 3.6V
  • Power - Output:4dBm
  • Protocol:Zigbee®
  • Serial Interfaces:I²C, I²S, JTAG, SPI, UART
  • R F Family/ Standard:802.15.4
  • Current - Receiving:22mA ~ 24mA
  • Modulation:O-QPSK
  • G P I O:64
  • Current - Transmitting:29mA
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC13226V provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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