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Rochester Electronics MC10EP08DTG

IC GATE XOR/XNOR ECL 2INP 8TSSOP
part number has RoHS
Manufacturer # :MC10EP08DTG
Manufacturer :Rochester Electronics
Dasenic # :MC10EP08DTG-DS
Customer # :
Description : IC GATE XOR/XNOR ECL 2INP 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.9310$ 5.93
25+$ 5.8140$ 145.35
100+$ 5.5710$ 557.1
500+$ 5.3370$ 2668.5
1000+$ 5.0400$ 5040
In Stock: 43051
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.931
Total :$ 5.93
Delivery :
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MC10EP08DTG information

  • Rochester Electronics MC10EP08DTG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters - Multi-Function, Configurable
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Output Type:Differential
  • Supplier Device Package:8-TSSOP
  • Number of Circuits:1
  • Voltage - Supply:3V ~ 5.5V
  • Number of Inputs:2 Input (1, 1)
  • Logic Type:XOR/XNOR Gate
  • Current - Output High, Low:-
  • Schmitt Trigger Input:No
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC10EP08DTG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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