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  • Rochester Electronics MC100LVEP210MNG

    IC CLK BUFFER 1:5 3GHZ 32QFN
  • part number has RoHS
  • Mfr.Part # :MC100LVEP210MNG
  • Manufacturer :Rochester Electronics
  • Dasenic # :MC100LVEP210MNG-DS
  • Datasheet :pdf download MC100LVEP210MNG Datasheet
  • Description : IC CLK BUFFER 1:5 3GHZ 32QFN
  • Package :-
  • Quantity :
    Unit Price : $ 13.4775Total : $ 13.48
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 11777
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
26 +$ 13.4775$ 350.42
100 +$ 12.9263$ 1292.63
500 +$ 12.3750$ 6187.50
1000 +$ 11.6888$ 11688.80

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Rochester Electronics MC100LVEP210MNG technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Clock Buffers, Drivers
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:32-VFQFN Exposed Pad
Type:Fanout Buffer (Distribution)
Supplier Device Package:32-QFN (5x5)
Frequency - Max:3 GHz
Number of Circuits:2
Output:ECL, PECL
Voltage - Supply:2.375V ~ 3.8V
Input:ECL, HSTL, LVDS, PECL
Ratio - Input: Output:1:5
Differential - Input: Output:Yes/Yes
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
EU RoHS Status:RoHS Compliant
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC100LVEP210MNG provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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