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Rochester Electronics MC100LVEL33DTG

IC DIVIDER DIV X4 ECL DFF 8TSSOP
part number has RoHS
Manufacturer # :MC100LVEL33DTG
Manufacturer :Rochester Electronics
Dasenic # :MC100LVEL33DTG-DS
Customer # :
Description : IC DIVIDER DIV X4 ECL DFF 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.1190$ 7.12
25+$ 6.9750$ 174.38
100+$ 6.6960$ 669.6
500+$ 6.4080$ 3204
1000+$ 6.0480$ 6048
In Stock: 33409
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.119
Total :$ 7.12
Delivery :
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Payment :
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MC100LVEL33DTG information

  • Rochester Electronics MC100LVEL33DTG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Counters, Dividers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Direction:-
  • Supplier Device Package:8-TSSOP
  • Number of Elements:1
  • Voltage - Supply:3 V ~ 3.8 V
  • Logic Type:Divide-by-4
  • Number of Bits per Element:1
  • Reset:Asynchronous
  • Timing:-
  • Count Rate:4 GHz
  • Trigger Type:Positive, Negative
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC100LVEL33DTG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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