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Rochester Electronics MC100LVEL13DWR2

IC CLOCK BUFFER 1:3 1GHZ 20-SOIC
part number has RoHS
Manufacturer # :MC100LVEL13DWR2
Manufacturer :Rochester Electronics
Dasenic # :MC100LVEL13DWR2-DS
Customer # :
Description : IC CLOCK BUFFER 1:3 1GHZ 20-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.8800$ 17.88
25+$ 17.5200$ 438
100+$ 16.8000$ 1680
500+$ 16.1000$ 8050
1000+$ 15.2000$ 15200
In Stock: 1501
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.88
Total :$ 17.88
Delivery :
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Payment :
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MC100LVEL13DWR2 information

  • Rochester Electronics MC100LVEL13DWR2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:20-SOIC (0.295", 7.50mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:20-SOIC
  • Frequency - Max:-
  • Number of Circuits:-
  • Output:-
  • Voltage - Supply:-
  • Input:-
  • Ratio - Input: Output:1:3
  • Differential - Input: Output:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC100LVEL13DWR2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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