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1 : $6.4125
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Rochester Electronics MC100H680FN
IC TRNSLTR BIDIRECTIONAL 28PLCC
Manufacturer # :MC100H680FN
Manufacturer :Rochester Electronics
Dasenic # :MC100H680FN-DS
Datasheet :
MC100H680FN Datasheet
MC100H680FN DatasheetCustomer # :
Description : IC TRNSLTR BIDIRECTIONAL 28PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.4125 | $ 6.41 |
In Stock: 34506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.4125
Total :$ 6.41
Delivery :
Payment :
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MC100H680FN information
Rochester Electronics MC100H680FN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Translators, Level Shifters
- Product Status:Obsolete
- Operating Temperature:0°C ~ 75°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Output Type:Differential, Single-Ended
- Supplier Device Package:28-PLCC (11.51x11.51)
- Number of Circuits:1
- Data Rate:-
- Input Signal:ECL
- Output Signal:TTL
- Translator Type:Mixed Signal
- Channel Type:Bidirectional
- Channels per Circuit:4
- Voltage - V C C A:-
- Voltage - V C C B:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC100H680FN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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