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1 : $2.6190
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Rochester Electronics MC100EP58DT
IC MUX 2:1 3.3/5V ECL 8TSSOP
Manufacturer # :MC100EP58DT
Manufacturer :Rochester Electronics
Dasenic # :MC100EP58DT-DS
Datasheet :
MC100EP58DT Datasheet
MC100EP58DT DatasheetCustomer # :
Description : IC MUX 2:1 3.3/5V ECL 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.6190 | $ 2.62 |
| 25+ | $ 2.5650 | $ 64.13 |
| 100+ | $ 2.4660 | $ 246.6 |
| 500+ | $ 2.3580 | $ 1179 |
| 1000+ | $ 2.2320 | $ 2232 |
In Stock: 19568
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.619
Total :$ 2.62
Delivery :
Payment :
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MC100EP58DT information
Rochester Electronics MC100EP58DT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Type:Multiplexer
- Supplier Device Package:8-TSSOP
- Voltage - Supply:±3V ~ 5.5V
- Voltage Supply Source:Dual Supply
- Current - Output High, Low:-
- Circuit:1 x 2:1
- Independent Circuits:1
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MC100EP58DT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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