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Rochester Electronics MB90462PFM-G-305-SNE1
Manufacturer # :MB90462PFM-G-305-SNE1
Manufacturer :Rochester Electronics
Dasenic # :MB90462PFM-G-305-SNE1-DS
Datasheet : MB90462PFM-G-305-SNE1 Datasheet
Customer # :
Description : IC MICROCONTROLLER 64LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1730
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.118
Total :$ 8.12
Delivery :
Payment :
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MB90462PFM-G-305-SNE1 information
Rochester Electronics MB90462PFM-G-305-SNE1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:64-LQFP
- Supplier Device Package:64-QFP (12x12)
- Peripherals:POR, PWM, WDT
- Number of I/ O:51
- Speed:16MHz
- E E P R O M Size:-
- Core Processor:F²MC-16LX
- R A M Size:2K x 8
- Program Memory Type:Mask ROM
- Core Size:16-Bit
- Connectivity:UART/USART
- Program Memory Size:64KB (64K x 8)
- Voltage - Supply ( Vcc/ Vdd):3V ~ 5.5V
- Data Converters:A/D 8x8/10b
- Oscillator Type:External
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MB90462PFM-G-305-SNE1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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