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Rochester Electronics MAXQ2000-QBX
Manufacturer # :MAXQ2000-QBX
Manufacturer :Rochester Electronics
Dasenic # :MAXQ2000-QBX-DS
Datasheet : MAXQ2000-QBX Datasheet
Customer # :
Description : IC MCU 16BIT 64KB FLASH 56TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6263
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.068
Total :$ 4.07
Delivery :
Payment :
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MAXQ2000-QBX information
Rochester Electronics MAXQ2000-QBX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:56-WFQFN Exposed Pad
- Supplier Device Package:56-TQFN (8x8)
- Peripherals:LCD, POR, PWM, WDT
- Number of I/ O:50
- Speed:20MHz
- E E P R O M Size:-
- Core Processor:-
- R A M Size:2K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:1-Wire®, SPI, UART/USART
- Program Memory Size:64KB (32K x 16)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 2.75V
- Data Converters:-
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAXQ2000-QBX provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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