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Rochester Electronics MAX9888EWY+

IC POWER MANAGEMENT
part number has RoHS
Manufacturer # :MAX9888EWY+
Manufacturer :Rochester Electronics
Dasenic # :MAX9888EWY+-DS
Customer # :
Description : IC POWER MANAGEMENT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.5740$ 2.57
25+$ 2.5200$ 63
100+$ 2.4210$ 242.1
500+$ 2.3130$ 1156.5
1000+$ 2.1870$ 2187
In Stock: 8600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.574
Total :$ 2.57
Delivery :
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Payment :
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MAX9888EWY+ information

  • Rochester Electronics MAX9888EWY+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Differential Inputs, I²S, Microphone, Mute, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:63-WFBGA, WLBGA
  • Type:Class D
  • Output Type:3-Channel with Stereo Headphones
  • Supplier Device Package:63-WLP (3.28x3.78)
  • Voltage - Supply:2.8V ~ 5.5V
  • Max Output Power x Channels @ Load:1.37W x 2 @ 8Ohm; 40mW x 2 @ 16Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:OBSOLETE
  • HTS US:0000.00.0000
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX9888EWY+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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