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1 : $1.0080
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Rochester Electronics MAX9762ETI
STEREO AUDIO POWER AMPLIFIER
Manufacturer # :MAX9762ETI
Manufacturer :Rochester Electronics
Dasenic # :MAX9762ETI-DS
Datasheet :
MAX9762ETI Datasheet
MAX9762ETI DatasheetCustomer # :
Description : STEREO AUDIO POWER AMPLIFIER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.0080 | $ 1.01 |
| 25+ | $ 0.9900 | $ 24.75 |
| 100+ | $ 0.9450 | $ 94.5 |
| 500+ | $ 0.9090 | $ 454.5 |
| 1000+ | $ 0.8568 | $ 856.8 |
In Stock: 9846
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.008
Total :$ 1.01
Delivery :
Payment :
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MAX9762ETI information
Rochester Electronics MAX9762ETI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:28-WFQFN Exposed Pad
- Type:Class AB
- Output Type:2-Channel (Stereo) with Stereo Headphones
- Supplier Device Package:28-TQFN (5x5)
- Voltage - Supply:4.5V ~ 5.5V
- Max Output Power x Channels @ Load:3W x 2 @ 3Ohm
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX9762ETI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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