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Rochester Electronics MAX9761ETI+

IC AMP CLASS AB STEREO 3W 28TQFN
part number has RoHS
Manufacturer # :MAX9761ETI+
Manufacturer :Rochester Electronics
Dasenic # :MAX9761ETI+-DS
Customer # :
Description : IC AMP CLASS AB STEREO 3W 28TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.9530$ 1.95
25+$ 1.9170$ 47.93
100+$ 1.8360$ 183.6
500+$ 1.7550$ 877.5
1000+$ 1.6560$ 1656
In Stock: 3246
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.953
Total :$ 1.95
Delivery :
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Payment :
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MAX9761ETI+ information

  • Rochester Electronics MAX9761ETI+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Input Multiplexer, Mute, Shutdown, Thermal Protection
  • Mounting Type:Surface Mount
  • Package / Case:28-WFQFN Exposed Pad
  • Type:Class AB
  • Output Type:2-Channel (Stereo) with Stereo Headphones
  • Supplier Device Package:28-TQFN (5x5)
  • Voltage - Supply:4.5V ~ 5.5V
  • Max Output Power x Channels @ Load:3W x 2 @ 3Ohm; 200mW x 2 @ 16Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX9761ETI+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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