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Rochester Electronics MAX9741ETN+D

IC AMP CLASS D STEREO 12W 56TQFN
part number has RoHS
Manufacturer # :MAX9741ETN+D
Manufacturer :Rochester Electronics
Dasenic # :MAX9741ETN+D-DS
Customer # :
Description : IC AMP CLASS D STEREO 12W 56TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.8466$ 3.85
10+$ 3.2256$ 32.26
50+$ 2.8530$ 142.65
100+$ 2.5416$ 254.16
500+$ 2.5380$ 1269
In Stock: 3351
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.8466
Total :$ 3.85
Delivery :
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Payment :
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MAX9741ETN+D information

  • Rochester Electronics MAX9741ETN+D technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:56-WFQFN Exposed Pad
  • Type:Class D
  • Output Type:2-Channel (Stereo)
  • Supplier Device Package:56-TQFN (8x8)
  • Voltage - Supply:10V ~ 25V
  • Max Output Power x Channels @ Load:12W x 2 @ 8Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX9741ETN+D provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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