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Rochester Electronics MAX9724DETC+

IC AMP CLASS AB STER 63MW 12TQFN
part number has RoHS
Manufacturer # :MAX9724DETC+
Manufacturer :Rochester Electronics
Dasenic # :MAX9724DETC+-DS
Customer # :
Description : IC AMP CLASS AB STER 63MW 12TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.5947$ 0.59
25+$ 0.5828$ 14.57
100+$ 0.5591$ 55.91
500+$ 0.5352$ 267.6
1000+$ 0.5055$ 505.5
In Stock: 6840
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5947
Total :$ 0.59
Delivery :
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MAX9724DETC+ information

  • Rochester Electronics MAX9724DETC+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:12-WFQFN Exposed Pad
  • Type:Class AB
  • Output Type:Headphones, 2-Channel (Stereo)
  • Supplier Device Package:12-TQFN (3x3)
  • Voltage - Supply:2.5V ~ 5.5V
  • Max Output Power x Channels @ Load:63mW x 2 @ 32Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX9724DETC+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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