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Rochester Electronics MAX9314ECJ+

IC CLK BUFFER 1:5
part number has RoHS
Manufacturer # :MAX9314ECJ+
Manufacturer :Rochester Electronics
Dasenic # :MAX9314ECJ+-DS
Customer # :
Description : IC CLK BUFFER 1:5
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 8.0550$ 8.06
25+$ 7.8930$ 197.33
100+$ 7.5690$ 756.9
500+$ 7.2540$ 3627
1000+$ 6.8490$ 6849
In Stock: 4248
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.055
Total :$ 8.05
Delivery :
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Payment :
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MAX9314ECJ+ information

  • Rochester Electronics MAX9314ECJ+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-LQFP
  • Type:Fanout Buffer (Distribution), Data
  • Supplier Device Package:32-LQFP (7x7)
  • Frequency - Max:3 GHz
  • Number of Circuits:2
  • Output:LVECL, LVPECL
  • Voltage - Supply:2.25V ~ 3.8V
  • Input:HSTL, LVECL, LVPECL
  • Ratio - Input: Output:1:5
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX9314ECJ+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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