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Rochester Electronics MAX7302AEE+

IC LED DRIVER LINEAR 25MA 16QSOP
part number has RoHS
Manufacturer # :MAX7302AEE+
Manufacturer :Rochester Electronics
Dasenic # :MAX7302AEE+-DS
Customer # :
Description : IC LED DRIVER LINEAR 25MA 16QSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.8890$ 2.89
25+$ 2.8350$ 70.88
100+$ 2.7180$ 271.8
500+$ 2.6010$ 1300.5
1000+$ 2.4570$ 2457
In Stock: 18454
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.889
Total :$ 2.89
Delivery :
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MAX7302AEE+ information

  • Rochester Electronics MAX7302AEE+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - LED Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SSOP (0.154", 3.90mm Width)
  • Frequency:1MHz
  • Type:Linear
  • Supplier Device Package:16-QSOP
  • Internal Switch(s):-
  • Voltage - Output:-
  • Current - Output / Channel:25mA
  • Number of Outputs:9
  • Topology:-
  • Voltage - Supply ( Max):3.6V
  • Voltage - Supply ( Min):1.62V
  • Dimming:-
  • Applications:Backlight
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX7302AEE+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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