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Rochester Electronics MAX6616AEG+
Manufacturer # :MAX6616AEG+
Manufacturer :Rochester Electronics
Dasenic # :MAX6616AEG+-DS
Datasheet : MAX6616AEG+ Datasheet
Customer # :
Description : IC TEMP MON FAN CNTRL 24QSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 12462
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.574
Total :$ 2.57
Delivery :
Payment :
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MAX6616AEG+ information
Rochester Electronics MAX6616AEG+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Thermal Management
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:24-SSOP (0.154", 3.90mm Width)
- Output Type:I²C/SMBus
- Supplier Device Package:24-QSOP
- Voltage - Supply:3V ~ 5.5V
- Sensor Type:Internal and External
- Topology:ADC
- Accuracy:±4°C Local(Max), ±1°C Remote(Max)
- Sensing Temperature:0°C ~ 140°C
- Output Alarm:Yes
- Output Fan:Yes
- Function:Fan Control, Temp Monitor
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX6616AEG+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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