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Rochester Electronics MAX6037BAUK25

LOW-POWER, FIXED REFERENCE
part number has RoHS
Manufacturer # :MAX6037BAUK25
Manufacturer :Rochester Electronics
Dasenic # :MAX6037BAUK25-DS
Customer # :
Description : LOW-POWER, FIXED REFERENCE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.1060$ 2.11
25+$ 2.0610$ 51.53
100+$ 1.9800$ 198
500+$ 1.8990$ 949.5
1000+$ 1.7910$ 1791
In Stock: 1890
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.106
Total :$ 2.11
Delivery :
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Payment :
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MAX6037BAUK25 information

  • Rochester Electronics MAX6037BAUK25 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
  • Product Status:Active
  • Tolerance:-
  • Temperature Coefficient:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Current - Supply:-
  • Voltage - Input:-
  • Output Type:-
  • Supplier Device Package:-
  • Reference Type:-
  • Current - Output:-
  • Voltage - Output ( Min/ Fixed):-
  • Voltage - Output ( Max):-
  • Noise - 0.1 Hz to 10 Hz:-
  • Noise - 10 Hz to 10k Hz:-
  • Current - Cathode:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX6037BAUK25 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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