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1 : $6.7770
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Rochester Electronics MAX5931HEEP+
IC HOT SWAP CTRLR GP 20QSOP
Manufacturer # :MAX5931HEEP+
Manufacturer :Rochester Electronics
Dasenic # :MAX5931HEEP+-DS
Datasheet :
MAX5931HEEP+ Datasheet
MAX5931HEEP+ DatasheetCustomer # :
Description : IC HOT SWAP CTRLR GP 20QSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 40+ | $ 6.7770 | $ 271.08 |
In Stock: 12615
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.777
Total :$ 6.78
Delivery :
Payment :
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MAX5931HEEP+ information
Rochester Electronics MAX5931HEEP+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:Fault Timeout
- Mounting Type:Surface Mount
- Package / Case:20-SSOP (0.154", 3.90mm Width)
- Current - Supply:2.5 mA
- Type:Hot Swap Controller
- Number of Channels:3
- Supplier Device Package:20-QSOP
- Internal Switch(s):No
- Voltage - Supply:1V ~ 13.2V
- Programmable Features:Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, UVLO
- Current - Output ( Max):-
- Applications:General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX5931HEEP+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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