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1 : $103.6000
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Rochester Electronics MAX541ACPA
IC DAC 16BIT V-OUT 8DIP
Manufacturer # :MAX541ACPA
Manufacturer :Rochester Electronics
Dasenic # :MAX541ACPA-DS
Datasheet :
MAX541ACPA Datasheet
MAX541ACPA DatasheetCustomer # :
Description : IC DAC 16BIT V-OUT 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 103.6000 | $ 1036 |
| 10000+ | $ 51.8000 | $ 518000 |
In Stock: 1441
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 103.6
Total :$ 103.60
Delivery :
Payment :
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MAX541ACPA information
Rochester Electronics MAX541ACPA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Output Type:Voltage - Unbuffered
- Supplier Device Package:8-PDIP
- Data Interface:SPI
- Number of Bits:16
- Voltage - Supply, Analog:5V
- Voltage - Supply, Digital:5V
- Architecture:R-2R
- Reference Type:External
- Number of D/ A Converters:1
- Settling Time:1µs (Typ)
- Differential Output:No
- I N L/ D N L ( L S B):±0.5, ±0.5
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX541ACPA provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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