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Rochester Electronics MAX5111GWX+

IC POWER MANAGEMENT
part number has RoHS
Manufacturer # :MAX5111GWX+
Manufacturer :Rochester Electronics
Dasenic # :MAX5111GWX+-DS
Customer # :
Description : IC POWER MANAGEMENT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 21.0600$ 21.06
25+$ 20.6370$ 515.93
100+$ 19.8000$ 1980
500+$ 18.9540$ 9477
1000+$ 17.9010$ 17901
In Stock: 5634
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 21.06
Total :$ 21.06
Delivery :
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Payment :
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MAX5111GWX+ information

  • Rochester Electronics MAX5111GWX+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:36-WFBGA, WLBGA
  • Output Type:-
  • Supplier Device Package:36-WLP (3.07x3.07)
  • Data Interface:I²C
  • Number of Bits:14
  • Voltage - Supply, Analog:3V
  • Voltage - Supply, Digital:3V
  • Architecture:-
  • Reference Type:Internal
  • Number of D/ A Converters:-
  • Settling Time:-
  • Differential Output:-
  • I N L/ D N L ( L S B):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX5111GWX+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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