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1 : $35.2350
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Rochester Electronics MAX5110GWX+
IC INTEGRATED CIRCUIT
Manufacturer # :MAX5110GWX+
Manufacturer :Rochester Electronics
Dasenic # :MAX5110GWX+-DS
Datasheet :
MAX5110GWX+ Datasheet
MAX5110GWX+ DatasheetCustomer # :
Description : IC INTEGRATED CIRCUIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 35.2350 | $ 35.24 |
| 25+ | $ 34.5330 | $ 863.33 |
| 100+ | $ 33.1200 | $ 3312 |
| 500+ | $ 31.7160 | $ 15858 |
| 1000+ | $ 29.9520 | $ 29952 |
In Stock: 6267
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 35.235
Total :$ 35.23
Delivery :
Payment :
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MAX5110GWX+ information
Rochester Electronics MAX5110GWX+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Output Type:-
- Supplier Device Package:-
- Data Interface:-
- Number of Bits:-
- Voltage - Supply, Analog:-
- Voltage - Supply, Digital:-
- Architecture:-
- Reference Type:-
- Number of D/ A Converters:-
- Settling Time:-
- Differential Output:-
- I N L/ D N L ( L S B):-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX5110GWX+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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