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Rochester Electronics MAX4189EEE+

IC AMP CURRENT FEEDBACK 16QSOP
part number has RoHS
Manufacturer # :MAX4189EEE+
Manufacturer :Rochester Electronics
Dasenic # :MAX4189EEE+-DS
Customer # :
Description : IC AMP CURRENT FEEDBACK 16QSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.5460$ 3.55
25+$ 3.4740$ 86.85
100+$ 3.3300$ 333
500+$ 3.1950$ 1597.5
1000+$ 3.0150$ 3015
In Stock: 5376
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.546
Total :$ 3.55
Delivery :
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Payment :
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MAX4189EEE+ information

  • Rochester Electronics MAX4189EEE+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Video Amps and Modules
  • Product Status:Obsolete
  • Mounting Type:Surface Mount
  • Package / Case:16-SSOP (0.154", 3.90mm Width)
  • Current - Supply:1.5 mA
  • Output Type:-
  • Supplier Device Package:16-QSOP
  • Number of Circuits:3
  • -3db Bandwidth:250 MHz
  • Current - Output / Channel:55 mA
  • Slew Rate:175V/µs
  • Voltage - Supply, Single/ Dual (±):4.5V ~ 11V, ±2.25V ~ 5.5V
  • Applications:Current Feedback
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX4189EEE+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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