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1 : $7.1640
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Rochester Electronics MAX3667ECJ
IC LASER DRVR 622MBPS 5V 32LQFP
Manufacturer # :MAX3667ECJ
Manufacturer :Rochester Electronics
Dasenic # :MAX3667ECJ-DS
Datasheet :
MAX3667ECJ Datasheet
MAX3667ECJ DatasheetCustomer # :
Description : IC LASER DRVR 622MBPS 5V 32LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 7.1640 | $ 7.16 |
| 25+ | $ 7.0200 | $ 175.5 |
| 100+ | $ 6.7320 | $ 673.2 |
| 500+ | $ 6.4440 | $ 3222 |
| 1000+ | $ 6.0930 | $ 6093 |
In Stock: 7338
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.164
Total :$ 7.16
Delivery :
Payment :
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MAX3667ECJ information
Rochester Electronics MAX3667ECJ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Laser Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-LQFP
- Current - Supply:112 mA
- Type:Laser Diode Driver (Fiber Optic)
- Number of Channels:1
- Supplier Device Package:32-LQFP (7x7)
- Voltage - Supply:3.3V, 5V
- Data Rate:622Mbps
- Current - Modulation:60mA
- Current - Bias:90 mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX3667ECJ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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