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1 : $6.9480
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Rochester Electronics MAX3667ECJ+
IC LASER DRVR 622MBPS 5V 32LQFP
Manufacturer # :MAX3667ECJ+
Manufacturer :Rochester Electronics
Dasenic # :MAX3667ECJ+-DS
Datasheet :
MAX3667ECJ+ Datasheet
MAX3667ECJ+ DatasheetCustomer # :
Description : IC LASER DRVR 622MBPS 5V 32LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.9480 | $ 6.95 |
| 25+ | $ 6.8130 | $ 170.33 |
| 100+ | $ 6.5340 | $ 653.4 |
| 500+ | $ 6.2550 | $ 3127.5 |
| 1000+ | $ 5.9040 | $ 5904 |
In Stock: 11283
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.948
Total :$ 6.95
Delivery :
Payment :
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MAX3667ECJ+ information
Rochester Electronics MAX3667ECJ+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Laser Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-LQFP
- Current - Supply:112 mA
- Type:Laser Diode Driver (Fiber Optic)
- Number of Channels:1
- Supplier Device Package:32-LQFP (7x7)
- Voltage - Supply:3.3V, 5V
- Data Rate:622Mbps
- Current - Modulation:60mA
- Current - Bias:90 mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX3667ECJ+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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