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Rochester Electronics MAX31851SATB+

IC THRMOCPLE TO DIG CONV 10TDFN
part number has RoHS
Manufacturer # :MAX31851SATB+
Manufacturer :Rochester Electronics
Dasenic # :MAX31851SATB+-DS
Customer # :
Description : IC THRMOCPLE TO DIG CONV 10TDFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.8430$ 3.84
25+$ 3.7620$ 94.05
100+$ 3.6090$ 360.9
500+$ 3.4560$ 1728
1000+$ 3.2670$ 3267
In Stock: 9447
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.843
Total :$ 3.84
Delivery :
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Payment :
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MAX31851SATB+ information

  • Rochester Electronics MAX31851SATB+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Sensor and Detector Interfaces
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:10-WFDFN Exposed Pad
  • Input Type:Thermocouple (Multiple)
  • Current - Supply:900 µA
  • Type:Thermocouple to Digital Converter
  • Output Type:Digital
  • Supplier Device Package:10-TDFN (3x4)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX31851SATB+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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