Name: MAX3001EEUP
Brand: Rochester Electronics
SKU: DS-5966190
Price: 2.997 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $2.9970

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Rochester Electronics MAX3001EEUP

8-CH LEVEL TRANSLATOR

Manufacturer # :MAX3001EEUP

Manufacturer :Rochester Electronics

Dasenic # :MAX3001EEUP-DS

Datasheet :

MAX3001EEUP Datasheet

Customer # :

Customer #

Description : 8-CH LEVEL TRANSLATOR

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
1+	$ 2.9970	$ 3
25+	$ 2.9340	$ 73.35
100+	$ 2.8170	$ 281.7
500+	$ 2.7000	$ 1350
1000+	$ 2.5470	$ 2547

In Stock: 12773

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 2.997

Total :$ 3.00

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Payment :

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MAX3001EEUP information

Rochester Electronics MAX3001EEUP technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Logic - Translators, Level Shifters
Product Status:Active
Operating Temperature:-
Features:-
Mounting Type:-
Package / Case:-
Output Type:-
Supplier Device Package:-
Number of Circuits:-
Data Rate:-
Input Signal:-
Output Signal:-
Translator Type:-
Channel Type:-
Channels per Circuit:-
Voltage - V C C A:-
Voltage - V C C B:-
EU RoHS Status:RoHS non-compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Affected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Rochester Electronics MAX3001EEUP
Datasheet:
MAX3001EEUP,

Rochester Electronics MAX3001EEUP Environmental and export classification status description
The Maxim Integrated MAX3001EEUP is a bio-potential and bio-impedance sensor front-end module designed for medical applications. It integrates several functions to enable the measurement of bio-potential signals (ECG/EMG) and bio-impedance spectroscopy for applications such as patient monitoring, fitness monitoring, and portable medical devices. Functions: - Bio-potential signal conditioning for ECG and EMG measurements - Bio-impedance measurement for body composition analysis, respiratory measurement, etc. - Built-in analog front-end for signal processing - Digital signal processing capabilities - Low-power operation for portable applications Applications: - Wearable health and fitness devices - Remote patient monitoring systems - ECG and EMG measurement equipment - Body composition analyzers - Bio-impedance spectroscopy devices Alternative Components: - Analog Devices AD8233 - Texas Instruments ADS1293 - NXP Semiconductors MMA9555L - Silicon Labs Si1146 Embedded Modules: - MAX86150 - MAX86150C - MAX30003 - MAX31855 Related Q&A: 1. How does the Maxim Integrated MAX3001EEUP compare to other bio-potential sensor front-end modules? 2. What are the key advantages of using the MAX3001EEUP in wearable medical devices? 3. Can the MAX3001EEUP be used for both ECG and EMG signal measurements simultaneously? 4. What software tools are available to interface with and program the MAX3001EEUP for custom applications? 5. Are there any specific design considerations when using the MAX3001EEUP in battery-powered devices?

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

MAX3001EEUP provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.