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Rochester Electronics MAX2821AETM+

IC TXRX 802.11B 2.4GHZ 48-TQFN
part number has RoHS
Manufacturer # :MAX2821AETM+
Manufacturer :Rochester Electronics
Dasenic # :MAX2821AETM+-DS
Customer # :
Description : IC TXRX 802.11B 2.4GHZ 48-TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.7050$ 6.71
25+$ 6.5700$ 164.25
100+$ 6.3000$ 630
500+$ 6.0390$ 3019.5
1000+$ 5.6970$ 5697
In Stock: 7176
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.705
Total :$ 6.71
Delivery :
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Payment :
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MAX2821AETM+ information

  • Rochester Electronics MAX2821AETM+ technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Transceiver ICs
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:48-WFQFN Exposed Pad
  • Frequency:-
  • Type:-
  • Sensitivity:-
  • Supplier Device Package:48-TQFN (7x7)
  • Data Rate ( Max):-
  • Memory Size:-
  • Voltage - Supply:-
  • Power - Output:-
  • Protocol:-
  • Serial Interfaces:-
  • R F Family/ Standard:-
  • Current - Receiving:-
  • Modulation:-
  • G P I O:-
  • Current - Transmitting:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX2821AETM+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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