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Rochester Electronics MAX2160EBG+
Manufacturer # :MAX2160EBG+
Manufacturer :Rochester Electronics
Dasenic # :MAX2160EBG+-DS
Datasheet : MAX2160EBG+ Datasheet
Customer # :
Description : RF RECEIVER 470MHZ-770MHZ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 25289
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.169
Total :$ 2.17
Delivery :
Payment :
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MAX2160EBG+ information
Rochester Electronics MAX2160EBG+ technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Receivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:47-UFBGA, WLBGA
- Frequency:470MHz ~ 770MHz
- Sensitivity:-98dBm
- Supplier Device Package:47-WLP (3.175x3.175)
- Data Rate ( Max):-
- Memory Size:-
- Voltage - Supply:2.7V ~ 3.3V
- Data Interface:PCB, Surface Mount
- Modulation or Protocol:-
- Current - Receiving:-
- Antenna Connector:PCB, Surface Mount
- Applications:PDA's, Portable Audio/Video, Smartphones
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX2160EBG+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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