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1 : $17.3610
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Rochester Electronics MAX2027EUP-D
IC AMP ATE ISM 50-400MHZ 20TSSOP
Manufacturer # :MAX2027EUP-D
Manufacturer :Rochester Electronics
Dasenic # :MAX2027EUP-D-DS
Datasheet :
MAX2027EUP-D Datasheet
MAX2027EUP-D DatasheetCustomer # :
Description : IC AMP ATE ISM 50-400MHZ 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 17.3610 | $ 17.36 |
| 10+ | $ 13.5747 | $ 135.75 |
| 74+ | $ 17.3610 | $ 1284.71 |
| 148+ | $ 10.8004 | $ 1598.46 |
| 296+ | $ 10.2958 | $ 3047.56 |
In Stock: 1575
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.361
Total :$ 17.36
Delivery :
Payment :
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MAX2027EUP-D information
Rochester Electronics MAX2027EUP-D technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Amplifiers
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:20-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Frequency:50MHz ~ 400MHz
- Current - Supply:60mA ~ 75mA
- Supplier Device Package:20-TSSOP-EP
- Voltage - Supply:4.75V ~ 5.25V
- Gain:15.5dB
- Noise Figure:4.7dB
- P1d B:20.6dBm
- R F Type:ATE, ISM, PHS, UMTS, WLL
- Test Frequency:50MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX2027EUP-D provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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