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1 : $32.8950
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Rochester Electronics MAX186CEAP
IC DAS 12BIT 133K 20SSOP
Manufacturer # :MAX186CEAP
Manufacturer :Rochester Electronics
Dasenic # :MAX186CEAP-DS
Datasheet :
MAX186CEAP Datasheet
MAX186CEAP DatasheetCustomer # :
Description : IC DAS 12BIT 133K 20SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 32.8950 | $ 32.9 |
| 25+ | $ 32.2380 | $ 805.95 |
| 100+ | $ 30.9240 | $ 3092.4 |
| 500+ | $ 29.6100 | $ 14805 |
| 1000+ | $ 27.9630 | $ 27963 |
In Stock: 1537
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 32.895
Total :$ 32.90
Delivery :
Payment :
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MAX186CEAP information
Rochester Electronics MAX186CEAP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-SSOP (0.209", 5.30mm Width)
- Type:Data Acquisition
- Number of Channels:8
- Supplier Device Package:20-SSOP
- Voltage - Supply:-
- Resolution ( Bits):12 b
- Sampling Rate ( Per Second):133k
- Data Interface:Serial
- Voltage Supply Source:Dual ±
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX186CEAP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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