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Rochester Electronics MAX182BEWI
Manufacturer # :MAX182BEWI
Manufacturer :Rochester Electronics
Dasenic # :MAX182BEWI-DS
Datasheet : MAX182BEWI Datasheet
Customer # :
Description : IC ADC 12BIT SAR 28SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1505
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 63.38
Total :$ 63.38
Delivery :
Payment :
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MAX182BEWI information
Rochester Electronics MAX182BEWI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:28-SOIC (0.295", 7.50mm Width)
- Input Type:Single Ended
- Supplier Device Package:28-SOIC
- Configuration:MUX-S/H-ADC
- Sampling Rate ( Per Second):17k
- Data Interface:Parallel
- Number of Bits:12
- Voltage - Supply, Analog:±5V, 11.4V ~ 15.75V
- Voltage - Supply, Digital:±5V, 11.4V ~ 15.75V
- Number of Inputs:4
- Ratio - S/ H: A D C:1:1
- Number of A/ D Converters:1
- Architecture:SAR
- Reference Type:External
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX182BEWI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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