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Rochester Electronics MAX16977SAUE+
Manufacturer # :MAX16977SAUE+
Manufacturer :Rochester Electronics
Dasenic # :MAX16977SAUE+-DS
Datasheet : MAX16977SAUE+ Datasheet
Customer # :
Description : IC REG BUCK ADJ/5V 2A 16TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10959
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.547
Total :$ 2.55
Delivery :
Payment :
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MAX16977SAUE+ information
Rochester Electronics MAX16977SAUE+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Regulators
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Output Type:Adjustable (Fixed)
- Voltage - Input ( Max):36V
- Supplier Device Package:16-TSSOP-EP
- Current - Output:2A
- Frequency - Switching:2.2MHz
- Number of Outputs:1
- Topology:Buck
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):1V (5V)
- Voltage - Output ( Max):10V
- Synchronous Rectifier:No
- Voltage - Input ( Min):3.5V
- Function:Step-Down
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX16977SAUE+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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