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  • Rochester Electronics MAX16804ATP+

    IC LED DRVR LIN DIM 350MA 20TQFN
  • part number has RoHS
  • Mfr.Part # :MAX16804ATP+
  • Manufacturer :Rochester Electronics
  • Dasenic # :MAX16804ATP+-DS
  • Datasheet :pdf download MAX16804ATP+ Datasheet
  • Description : IC LED DRVR LIN DIM 350MA 20TQFN
  • Package :-
  • Quantity :
    Unit Price : $ 22.4787Total : $ 22.48
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1661
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 22.4787$ 22.48
25 +$ 22.0350$ 550.88
100 +$ 21.1477$ 2114.77
500 +$ 20.2604$ 10130.20
1000 +$ 19.0773$ 19077.30

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Rochester Electronics MAX16804ATP+ technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/LED Drivers
Product Status:Obsolete
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:20-WQFN Exposed Pad
Frequency:-
Type:Linear
Supplier Device Package:20-TQFN (5x5)
Internal Switch(s):Yes
Voltage - Output:39.5V
Current - Output / Channel:350mA
Number of Outputs:1
Topology:-
Voltage - Supply ( Max):40V
Voltage - Supply ( Min):5.5V
Dimming:Analog, PWM
Applications:Automotive, Signage
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX16804ATP+ provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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