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1 : $8.2140
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Rochester Electronics MAX164CENG
12-BIT ADC WITH T/H
Manufacturer # :MAX164CENG
Manufacturer :Rochester Electronics
Dasenic # :MAX164CENG-DS
Datasheet :
MAX164CENG Datasheet
MAX164CENG DatasheetCustomer # :
Description : 12-BIT ADC WITH T/H
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 7+ | $ 8.2140 | $ 57.5 |
| 7+ | $ 8.5563 | $ 59.89 |
| 10+ | $ 7.8034 | $ 78.03 |
| 10+ | $ 8.1285 | $ 81.29 |
In Stock: 38823
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.214
Total :$ 8.21
Delivery :
Payment :
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MAX164CENG information
Rochester Electronics MAX164CENG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Operating Temperature:-
- Features:-
- Mounting Type:-
- Package / Case:-
- Input Type:-
- Supplier Device Package:-
- Configuration:-
- Sampling Rate ( Per Second):-
- Data Interface:-
- Number of Bits:-
- Voltage - Supply, Analog:-
- Voltage - Supply, Digital:-
- Number of Inputs:-
- Ratio - S/ H: A D C:-
- Number of A/ D Converters:-
- Architecture:-
- Reference Type:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX164CENG provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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