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1 : $2.2950
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Rochester Electronics MAX13032EEBE+
6-CH LOGIC-LEVEL TRANSLATOR
Manufacturer # :MAX13032EEBE+
Manufacturer :Rochester Electronics
Dasenic # :MAX13032EEBE+-DS
Datasheet :
MAX13032EEBE+ Datasheet
MAX13032EEBE+ DatasheetCustomer # :
Description : 6-CH LOGIC-LEVEL TRANSLATOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.2950 | $ 2.3 |
| 25+ | $ 2.2500 | $ 56.25 |
| 100+ | $ 2.1600 | $ 216 |
| 500+ | $ 2.0700 | $ 1035 |
| 1000+ | $ 1.9530 | $ 1953 |
In Stock: 1906
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.295
Total :$ 2.29
Delivery :
Payment :
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MAX13032EEBE+ information
Rochester Electronics MAX13032EEBE+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Translators, Level Shifters
- Product Status:Obsolete
- Operating Temperature:-
- Features:-
- Mounting Type:-
- Package / Case:-
- Output Type:-
- Supplier Device Package:-
- Number of Circuits:-
- Data Rate:-
- Input Signal:-
- Output Signal:-
- Translator Type:-
- Channel Type:-
- Channels per Circuit:-
- Voltage - V C C A:-
- Voltage - V C C B:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX13032EEBE+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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