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Rochester Electronics MAX1294ACEI+
Manufacturer # :MAX1294ACEI+
Manufacturer :Rochester Electronics
Dasenic # :MAX1294ACEI+-DS
Datasheet : MAX1294ACEI+ Datasheet
Customer # :
Description : IC ADC 12BIT SAR 28QSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3750
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.561
Total :$ 15.56
Delivery :
Payment :
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MAX1294ACEI+ information
Rochester Electronics MAX1294ACEI+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.154", 3.90mm Width)
- Input Type:Pseudo-Differential, Single Ended
- Supplier Device Package:28-QSOP
- Configuration:MUX-S/H-ADC
- Sampling Rate ( Per Second):420k
- Data Interface:Parallel
- Number of Bits:12
- Voltage - Supply, Analog:5V
- Voltage - Supply, Digital:5V
- Number of Inputs:3, 6
- Ratio - S/ H: A D C:1:1
- Number of A/ D Converters:1
- Architecture:SAR
- Reference Type:External, Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX1294ACEI+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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