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1 : $11.0070
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Rochester Electronics MAX1273CPA+
IC ADC 12BIT 87KSPS 8-DIP
Manufacturer # :MAX1273CPA+
Manufacturer :Rochester Electronics
Dasenic # :MAX1273CPA+-DS
Datasheet :
MAX1273CPA+ Datasheet
MAX1273CPA+ DatasheetCustomer # :
Description : IC ADC 12BIT 87KSPS 8-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 11.0070 | $ 11.01 |
| 25+ | $ 10.7910 | $ 269.78 |
| 100+ | $ 10.3500 | $ 1035 |
| 500+ | $ 9.9090 | $ 4954.5 |
| 1000+ | $ 9.3600 | $ 9360 |
In Stock: 4506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.007
Total :$ 11.01
Delivery :
Payment :
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MAX1273CPA+ information
Rochester Electronics MAX1273CPA+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Type:Data Acquisition
- Number of Channels:1
- Supplier Device Package:8-PDIP
- Voltage - Supply:-
- Resolution ( Bits):12 b
- Sampling Rate ( Per Second):87k
- Data Interface:Serial
- Voltage Supply Source:Single Supply
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX1273CPA+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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