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Rochester Electronics MAX11336ATJ+
Manufacturer # :MAX11336ATJ+
Manufacturer :Rochester Electronics
Dasenic # :MAX11336ATJ+-DS
Datasheet : MAX11336ATJ+ Datasheet
Customer # :
Description : IC ADC 12BIT SAR 32TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9252
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.429
Total :$ 3.43
Delivery :
Payment :
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MAX11336ATJ+ information
Rochester Electronics MAX11336ATJ+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:32-WFQFN Exposed Pad
- Input Type:Differential, Pseudo-Differential, Single Ended
- Supplier Device Package:32-TQFN (5x5)
- Configuration:MUX-S/H-ADC
- Sampling Rate ( Per Second):500k
- Data Interface:SPI, DSP
- Number of Bits:12
- Voltage - Supply, Analog:2.35V ~ 3.6V
- Voltage - Supply, Digital:2.35V ~ 3.6V
- Number of Inputs:4, 8
- Ratio - S/ H: A D C:1:1
- Number of A/ D Converters:1
- Architecture:SAR
- Reference Type:External
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX11336ATJ+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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