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Rochester Electronics MAX11058ECB+
Manufacturer # :MAX11058ECB+
Manufacturer :Rochester Electronics
Dasenic # :MAX11058ECB+-DS
Datasheet : MAX11058ECB+ Datasheet
Customer # :
Description : IC ADC 14BIT SAR 64TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1980
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.269
Total :$ 10.27
Delivery :
Payment :
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MAX11058ECB+ information
Rochester Electronics MAX11058ECB+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:Simultaneous Sampling
- Mounting Type:Surface Mount
- Package / Case:64-TQFP Exposed Pad
- Input Type:Single Ended
- Supplier Device Package:64-TQFP-EP (10x10)
- Configuration:S/H-ADC
- Sampling Rate ( Per Second):250k
- Data Interface:Parallel
- Number of Bits:14
- Voltage - Supply, Analog:5V
- Voltage - Supply, Digital:2.7V ~ 5.25V
- Number of Inputs:6
- Ratio - S/ H: A D C:1:1
- Number of A/ D Converters:6
- Architecture:SAR
- Reference Type:External, Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX11058ECB+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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