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Rochester Electronics MAX1031BCEG

10-BIT 300KSPS ADCS WITH FIFO
part number has RoHS
Manufacturer # :MAX1031BCEG
Manufacturer :Rochester Electronics
Dasenic # :MAX1031BCEG-DS
Customer # :
Description : 10-BIT 300KSPS ADCS WITH FIFO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 11.5560$ 11.56
10+$ 11.0938$ 110.94
100+$ 10.4004$ 1040.04
1000+$ 10.2848$ 10284.8
10000+$ 10.1693$ 101693
In Stock: 39668
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.556
Total :$ 11.56
Delivery :
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Payment :
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MAX1031BCEG information

  • Rochester Electronics MAX1031BCEG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
  • Product Status:Active
  • Operating Temperature:-
  • Features:-
  • Mounting Type:-
  • Package / Case:-
  • Input Type:-
  • Supplier Device Package:-
  • Configuration:-
  • Sampling Rate ( Per Second):-
  • Data Interface:-
  • Number of Bits:-
  • Voltage - Supply, Analog:-
  • Voltage - Supply, Digital:-
  • Number of Inputs:-
  • Ratio - S/ H: A D C:-
  • Number of A/ D Converters:-
  • Architecture:-
  • Reference Type:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MAX1031BCEG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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