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Rochester Electronics MAX1021BETX+

IC ADC/DAC 10BIT 300K 36TQFN
part number has RoHS
Manufacturer # :MAX1021BETX+
Manufacturer :Rochester Electronics
Dasenic # :MAX1021BETX+-DS
Customer # :
Description : IC ADC/DAC 10BIT 300K 36TQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 13.2120$ 13.21
25+$ 12.9510$ 323.78
100+$ 12.4200$ 1242
500+$ 11.8890$ 5944.5
1000+$ 11.2320$ 11232
In Stock: 1570
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 13.212
Total :$ 13.21
Delivery :
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MAX1021BETX+ information

  • Rochester Electronics MAX1021BETX+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:36-WFQFN Exposed Pad
  • Type:ADC, DAC
  • Number of Channels:8
  • Supplier Device Package:36-TQFN (6x6)
  • Voltage - Supply:2.7V
  • Resolution ( Bits):10 b
  • Sampling Rate ( Per Second):300k
  • Data Interface:Serial
  • Voltage Supply Source:Analog and Digital
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX1021BETX+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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