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Rochester Electronics MACH110-20/BXA

HIGH-DENSITY EE PLD
part number has RoHS
Manufacturer # :MACH110-20/BXA
Manufacturer :Rochester Electronics
Dasenic # :MACH110-20/BXA-DS
Customer # :
Description : HIGH-DENSITY EE PLD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 113.1390$ 113.14
25+$ 110.8800$ 2772
100+$ 106.3530$ 10635.3
500+$ 101.8260$ 50913
1000+$ 96.1650$ 96165
In Stock: 6330
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 113.139
Total :$ 113.14
Delivery :
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MACH110-20/BXA information

  • Rochester Electronics MACH110-20/BXA technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-CQFP
  • Supplier Device Package:44-CQFP
  • Programmable Type:EE PLD
  • Delay Time tpd(1) Max:20 ns
  • Voltage Supply - Internal:4.5V ~ 5.5V
  • Number of Logic Elements/ Blocks:26
  • Number of Macrocells:32
  • Number of I/ O:32
  • Number of gates:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MACH110-20/BXA provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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