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1 : $37.7109
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Rochester Electronics M65856SP#TG0G
MICROPHONE AND ECHO SYSTEM
Manufacturer # :M65856SP#TG0G
Manufacturer :Rochester Electronics
Dasenic # :M65856SP#TG0G-DS
Datasheet :
M65856SP#TG0G Datasheet
M65856SP#TG0G DatasheetCustomer # :
Description : MICROPHONE AND ECHO SYSTEM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 37.7109 | $ 37.71 |
| 25+ | $ 36.9715 | $ 924.29 |
| 100+ | $ 35.4926 | $ 3549.26 |
| 500+ | $ 33.9398 | $ 16969.9 |
| 1000+ | $ 32.0913 | $ 32091.3 |
In Stock: 4590
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 37.7109
Total :$ 37.71
Delivery :
Payment :
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M65856SP#TG0G information
Rochester Electronics M65856SP#TG0G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Through Hole
- Package / Case:42-SDIP (0.600", 15.24mm)
- Number of Channels:2
- Interface:-
- Specifications:-
- Supplier Device Package:42-SDIP
- Voltage - Supply:4.5V ~ 5.5V
- Applications:Consumer Audio
- Function:Voice Processing Unit (VPU)
- EU RoHS Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:0000.00.0000
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
M65856SP#TG0G provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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