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1 : $6.2010

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Rochester Electronics M5M51008DVP-70HIBT

IC SRAM 1MBIT PARALLEL 32TSOP
part number has RoHS
Manufacturer # :M5M51008DVP-70HIBT
Manufacturer :Rochester Electronics
Dasenic # :M5M51008DVP-70HIBT-DS
Customer # :
Description : IC SRAM 1MBIT PARALLEL 32TSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.2010$ 6.2
25+$ 6.0750$ 151.88
100+$ 5.8320$ 583.2
500+$ 5.5800$ 2790
1000+$ 5.2740$ 5274
In Stock: 13860
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.201
Total :$ 6.20
Delivery :
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Payment :
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M5M51008DVP-70HIBT information

  • Rochester Electronics M5M51008DVP-70HIBT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-TFSOP (0.724", 18.40mm Width)
  • Technology:SRAM
  • Supplier Device Package:32-TSOP
  • Memory Size:1Mb (128K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:-
  • Access Time:70 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:70ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
M5M51008DVP-70HIBT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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