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Rochester Electronics M5M51008DFP-55H#BT

IC SRAM 1MBIT PARALLEL 32SOP
part number has RoHS
Manufacturer # :M5M51008DFP-55H#BT
Manufacturer :Rochester Electronics
Dasenic # :M5M51008DFP-55H#BT-DS
Customer # :
Description : IC SRAM 1MBIT PARALLEL 32SOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 48.5066$ 48.51
25+$ 47.5454$ 1188.64
100+$ 45.6228$ 4562.28
500+$ 43.6264$ 21813.2
1000+$ 41.2602$ 41260.2
In Stock: 10974
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 48.5066
Total :$ 48.51
Delivery :
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M5M51008DFP-55H#BT information

  • Rochester Electronics M5M51008DFP-55H#BT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-SOIC (0.450", 11.40mm Width)
  • Technology:SRAM
  • Supplier Device Package:32-SOP
  • Memory Size:1Mb (128K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:-
  • Access Time:55 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
M5M51008DFP-55H#BT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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