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Rochester Electronics LTC4252CCMS-1#PBF

IC HOT SWAP CTRLR -48V 10MSOP
part number has RoHS
Manufacturer # :LTC4252CCMS-1#PBF
Manufacturer :Rochester Electronics
Dasenic # :LTC4252CCMS-1#PBF-DS
Customer # :
Description : IC HOT SWAP CTRLR -48V 10MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 8.1450$ 8.15
10+$ 5.6241$ 56.24
25+$ 4.9738$ 124.35
100+$ 4.2460$ 424.6
250+$ 3.8933$ 973.33
In Stock: 5982
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.145
Total :$ 8.14
Delivery :
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Payment :
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LTC4252CCMS-1#PBF information

  • Rochester Electronics LTC4252CCMS-1#PBF technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Features:Latched Fault
  • Mounting Type:Surface Mount
  • Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Current - Supply:900 µA
  • Type:Hot Swap Controller
  • Number of Channels:1
  • Supplier Device Package:10-MSOP
  • Internal Switch(s):No
  • Voltage - Supply:-48V
  • Programmable Features:Current Limit, Fault Timeout, OVP, UVLO
  • Current - Output ( Max):-
  • Applications:-48V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LTC4252CCMS-1#PBF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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