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1 : $5.6250
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Rochester Electronics LTC1392IS8#PBF
IC DATA ACQ SYSTEM 10BIT 8-SOIC
Manufacturer # :LTC1392IS8#PBF
Manufacturer :Rochester Electronics
Dasenic # :LTC1392IS8#PBF-DS
Datasheet :
LTC1392IS8#PBF Datasheet
LTC1392IS8#PBF DatasheetCustomer # :
Description : IC DATA ACQ SYSTEM 10BIT 8-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 100+ | $ 5.6250 | $ 562.5 |
In Stock: 3600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.625
Total :$ 5.63
Delivery :
Payment :
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LTC1392IS8#PBF information
Rochester Electronics LTC1392IS8#PBF technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Thermal Management
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Output Type:Parallel, Serial
- Supplier Device Package:8-SO
- Voltage - Supply:4.5V ~ 6V
- Sensor Type:Internal
- Topology:ADC, Multiplexer, Voltage Reference
- Accuracy:±4°C
- Sensing Temperature:-40°C ~ 85°C
- Output Alarm:No
- Output Fan:No
- Function:Temp Monitoring System (Sensor)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LTC1392IS8#PBF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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