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Rochester Electronics LS1021AXE7MQB

LS1 32BIT ARM SOC, 1.2GHZ, DDR3/
part number has RoHS
Manufacturer # :LS1021AXE7MQB
Manufacturer :Rochester Electronics
Dasenic # :LS1021AXE7MQB-DS
Customer # :
Description : LS1 32BIT ARM SOC, 1.2GHZ, DDR3/
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 62.5230$ 62.52
10+$ 46.1430$ 461.43
In Stock: 1584
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 62.523
Total :$ 62.52
Delivery :
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LS1021AXE7MQB information

  • Rochester Electronics LS1021AXE7MQB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C
  • Package / Case:525-FBGA, FCBGA
  • Supplier Device Package:525-FCPBGA (19x19)
  • Voltage - I/ O:-
  • Speed:1.2GHz
  • Core Processor:ARM® Cortex®-A7
  • Number of Cores/ Bus Width:2 Core, 32-Bit
  • Co- Processors/ D S P:-
  • R A M Controllers:DDR3L, DDR4
  • Graphics Acceleration:-
  • Display & Interface Controllers:2D-ACE
  • Ethernet:GbE (3)
  • S A T A:SATA 6Gbps (1)
  • U S B:USB 3.0 (1) + PHY
  • Security Features:Secure Boot, TrustZone®
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LS1021AXE7MQB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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