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1 : $3.5460
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Rochester Electronics LPC47B273QFP
SUPER I/O CONTROLLER WITH LPC IN
Manufacturer # :LPC47B273QFP
Manufacturer :Rochester Electronics
Dasenic # :LPC47B273QFP-DS
Datasheet :
LPC47B273QFP Datasheet
LPC47B273QFP DatasheetCustomer # :
Description : SUPER I/O CONTROLLER WITH LPC IN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.5460 | $ 3.55 |
| 25+ | $ 3.4740 | $ 86.85 |
| 100+ | $ 3.3300 | $ 333 |
| 500+ | $ 3.1860 | $ 1593 |
| 1000+ | $ 3.0150 | $ 3015 |
In Stock: 26698
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.546
Total :$ 3.55
Delivery :
Payment :
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Provide 365 days warranty after-sales service
LPC47B273QFP information
Rochester Electronics LPC47B273QFP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Interface:-
- Supplier Device Package:-
- Voltage - Supply:-
- Number of I/ O:-
- Core Processor:-
- R A M Size:-
- Program Memory Type:-
- Controller Series:-
- Applications:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LPC47B273QFP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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